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[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects
Romero, David, Nabovati, Aydin, Refai-Ahmed, Gamal, Sellan, Daniel P., Ghalambor, Saeed, Shah, Niket, Agonafer, Dereje, Amon, Cristina H.Year:
2011
Language:
english
DOI:
10.1115/IPACK2011-52161
File:
PDF, 1.14 MB
english, 2011