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HBT IC process with copper substrate
Guthrie, J., Mensa, D., Agarwal, B., Lee, Q., Pullela, R., Rodwell, M.J.W.Volume:
34
Year:
1998
Language:
english
Journal:
Electronics Letters
DOI:
10.1049/el:19980372
File:
PDF, 368 KB
english, 1998