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Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications
Sun, Xiaoxuan, Peethala, Brown, Hopstaken, Marinus, Hu, Chao-kun, Mclaughlin, Paul S, van der Straten, O., Demarest, James, Motoyama, K., Nogami, Takeshi, Lin, Xuan, Zhang, Xunyuan, Kelly, JamesVolume:
80
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/08004.0297ecst
Date:
August, 2017
File:
PDF, 390 KB
english, 2017