Experimental location of damage in microelectronic solder...

Engineering Failure Analysis 2018 / 01 Vol. 83

Experimental location of damage in microelectronic solder joints after a board level reliability evaluation

Wu, I-Chih, Wang, Min-Haw, Jang, Ling-Sheng
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Volume:
83
Language:
english
Journal:
Engineering Failure Analysis
DOI:
10.1016/j.engfailanal.2017.10.002
Date:
January, 2018
File:
PDF, 1.47 MB
english, 2018
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