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Influence of slurry components on copper CMP performance in alkaline slurry
Xu, Qinzhi, Chen, Lan, Yang, Fei, Cao, HeLanguage:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2017.10.002
Date:
October, 2017
File:
PDF, 3.21 MB
english, 2017