A hybrid method of ultrafast laser dicing and high density...

Materials Science in Semiconductor Processing 2018 / 02 Vol. 74

A hybrid method of ultrafast laser dicing and high density plasma etching with water soluble mask for thin silicon wafer cutting

Wu, Shih-jeh
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Volume:
74
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2017.09.038
Date:
February, 2018
File:
PDF, 1.52 MB
english, 2018
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