![](/img/cover-not-exists.png)
[IEEE 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Bordeaux, France (2017.5.29-2017.6.1)] 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Co-design of an adaptive hyperspectral imager based on MEMS arrays: From proof of principle to a research prototype
Roul, Julien, Blanc, Frederic, Lacroix, Simon, Monmayrant, AntoineYear:
2017
Language:
english
DOI:
10.1109/dtip.2017.7984470
File:
PDF, 298 KB
english, 2017