Investigations on brittle-ductile cutting transition and crack formation in diamond cutting of mono-crystalline silicon
Liu, Haitao, Xie, Wenkun, Sun, Yazhou, Zhu, Xiufu, Wang, MinghaiLanguage:
english
Journal:
The International Journal of Advanced Manufacturing Technology
DOI:
10.1007/s00170-017-1108-1
Date:
October, 2017
File:
PDF, 4.24 MB
english, 2017