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Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film
Tsao, Lung-Chuan, Lin, Yen-Hui, Chuang, Cheng-Li, Chen, Jun-YouLanguage:
english
Journal:
Journal of the Chinese Institute of Engineers
DOI:
10.1080/02533839.2017.1384329
Date:
October, 2017
File:
PDF, 2.29 MB
english, 2017