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Solder Joint Reliability Prediction by the Integrated Matrix Creep Method
Iannuzzelli, R. J., Pitarresi, J. M., Prakash, V.Volume:
118
Year:
1996
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792132
File:
PDF, 768 KB
english, 1996