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A novel model for Through-Silicon Via (TSV) filling process simulation considering three additives and current density effect
Wang, Feng, Wang, Fuliang, Zhao, Zhipeng, Wang, Yan, Nie, NantianLanguage:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/1361-6439/aa9592
Date:
October, 2017
File:
PDF, 1.14 MB
english, 2017