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[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1 - Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump
Ishikawa, Shoho, Tohmyoh, Hironori, Saka, Masumi, Watanabe, Satoshi, Kuroha, Motohisa, Nakano, YoshikatsuYear:
2011
Language:
english
DOI:
10.1115/ipack2011-52112
File:
PDF, 704 KB
english, 2011