Morphologies and evolution of intermetallic compounds...

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Morphologies and evolution of intermetallic compounds formed between Sn1.0Ag0.7Cu composite solder and Cu substrate

Sui, Yan-Wei, Sun, Ren, Qi, Ji-Qiu, He, Ye-Zeng, Wei, Fu-Xiang, Meng, Qing-Kun, Sun, Zhi
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Language:
english
Journal:
Rare Metals
DOI:
10.1007/s12598-017-0968-8
Date:
November, 2017
File:
PDF, 1.57 MB
english, 2017
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