Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
Ge, Mengran, Zhu, Hongtao, Huang, Chuanzhen, Liu, Ao, Bi, WenboVolume:
74
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2017.10.027
Date:
February, 2018
File:
PDF, 2.42 MB
english, 2018