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Investigation on critical crack-free cutting depth for...

Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments

Ge, Mengran, Zhu, Hongtao, Huang, Chuanzhen, Liu, Ao, Bi, Wenbo
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Volume:
74
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2017.10.027
Date:
February, 2018
File:
PDF, 2.42 MB
english, 2018
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