Adhesive transfer at copper/diamond interface and adhesion...

Carbon 2018 / 02 Vol. 127

Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study

Liu, Zengjia, Zheng, Shaoxian, Lu, Zhibin, Pu, Jibin, Zhang, Guangan
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Volume:
127
Language:
english
Journal:
Carbon
DOI:
10.1016/j.carbon.2017.11.027
Date:
February, 2018
File:
PDF, 1.28 MB
english, 2018
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