Solid State Bonding of Silver Foils to Metalized Alumina...

Journal of Electronic Packaging 2011 Vol. 133; Iss. 4

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Sha, Chu-Hsuan, Wang, Pin J., Lin, Wen P., Lee, Chin C.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
133
Year:
2011
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4005295
File:
PDF, 687 KB
english, 2011
Conversion to is in progress
Conversion to is failed