Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method
Kim, S., Mayer, M., Persic, J., Moon, J. T.Volume:
137
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4028281
Date:
October, 2014
File:
PDF, 4.94 MB
english, 2014