Simplifying Reliability Testing of Wire Bonds Using On-Chip...

Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method

Kim, S., Mayer, M., Persic, J., Moon, J. T.
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Volume:
137
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4028281
Date:
October, 2014
File:
PDF, 4.94 MB
english, 2014
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