A further study on the analytical model for the...

A further study on the analytical model for the permeability in flip-chip packaging

Yao, X.J., Fang, J.J., Zhang, W.J. (Chris)
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Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4038391
Date:
November, 2017
File:
PDF, 1.91 MB
english, 2017
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