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[ASME ASME 2016 International Mechanical Engineering Congress and Exposition - Phoenix, Arizona, USA (Friday 11 November 2016)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - Experimental Measurement of Inter-Die Thermal Resistance in a Two Die 3D IC
Choobineh, Leila, Jain, Ankur, Jones, JaredYear:
2016
Language:
english
DOI:
10.1115/imece2016-65543
File:
PDF, 10.02 MB
english, 2016