Low Temperature Cu-Cu Bonding Technology in 3D Integration:...

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Low Temperature Cu-Cu Bonding Technology in 3D Integration: An Extensive Review

Panigrahy, Asisa Kumar, Chen, Kuan-Neng
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Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4038392
Date:
November, 2017
File:
PDF, 2.99 MB
english, 2017
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