Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due...

Journal of Electronic Packaging 2002 Vol. 124; Iss. 3

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

Sharma, Pradeep, Dasgupta, Abhijit
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Volume:
124
Year:
2002
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1493202
File:
PDF, 184 KB
english, 2002
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