Effect of copper- and silver-based films on alumina substrate electrical properties
Reboun, Jan, Hlina, Jiri, Totzauer, Pavel, Hamacek, AlesLanguage:
english
Journal:
Ceramics International
DOI:
10.1016/j.ceramint.2017.11.107
Date:
November, 2017
File:
PDF, 553 KB
english, 2017