Microstructure evolution during reflow and thermal aging in...

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Journal of Materials Science: Materials in Electronics 2017 / 11

Microstructure evolution during reflow and thermal aging in a Ag@Sn TLP bondline for high-temperature power devices

Guo, Qiang, Yu, Fuwen, Chen, Hongtao, Li, Mingyu
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Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-017-8232-4
Date:
November, 2017
File:
PDF, 2.57 MB
english, 2017
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