Research of Interaction Between Zn Based Solders and Cu, Al...

Research of Interaction Between Zn Based Solders and Cu, Al Substrates

Prach, Michal, Kostolný, Igor, Koleňák, Roman
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Volume:
22
Language:
english
Journal:
Research Papers Faculty of Materials Science and Technology Slovak University of Technology
DOI:
10.2478/rput-2014-0028
Date:
January, 2014
File:
PDF, 928 KB
english, 2014
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