A Detailed Thermal Model of the Infrared Reflow Soldering Process
Eftychiou, M. A., Bergman, T. L., Masada, G. Y.Volume:
115
Year:
1993
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2909302
File:
PDF, 960 KB
english, 1993