A novel multiscale silver paste for die bonding on bare...

A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air

Li, Jie, Li, Xin, Wang, Lei, Mei, Yun-Hui, Lu, Guo-Quan
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Volume:
140
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2017.11.054
Date:
February, 2018
File:
PDF, 1.82 MB
english, 2018
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