A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air
Li, Jie, Li, Xin, Wang, Lei, Mei, Yun-Hui, Lu, Guo-QuanVolume:
140
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2017.11.054
Date:
February, 2018
File:
PDF, 1.82 MB
english, 2018