Characterization of Delamination in Fiber-Reinforced...

IEEE Transactions on Components Packaging and Manufacturing Technology 2017 / 10 Vol. 7; Iss. 10

Characterization of Delamination in Fiber-Reinforced Epoxy-Based PCB Laminates, Using an EBG-Enhanced Planar Microwave Sensor

Samsingh, Vimal R., Subbaraj, Sangeetha, Malathi, Kanagasabai, Sundarsingh, Esther Florence, Yogeshwari, Paneerselvam, Saffrine, Kingsly, Rao, Y. V. Ramana
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2737783
Date:
October, 2017
File:
PDF, 1.42 MB
english, 2017
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