![](/img/cover-not-exists.png)
[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects
Dang, Bing, Joseph, Paul J., Wei, Xiaojin, Bakir, Muhannad S., Kohl, Paul A., Joshi, Yogendra K., Meindl, James D.Year:
2005
Language:
english
DOI:
10.1115/ipack2005-73416
File:
PDF, 615 KB
english, 2005