Experimental and Transient Thermal Analysis of Heat Sink...

IOP Conference Series Materials Science and Engineering 2017 / 05 Vol. 197

Experimental and Transient Thermal Analysis of Heat Sink Fin for CPU processor for better performance

Ravikumar, S., Subash Chandra, Parisaboina, Harish, Remella, Sivaji, Tallapaneni
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Volume:
197
Language:
english
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/197/1/012085
Date:
May, 2017
File:
PDF, 1.04 MB
english, 2017
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