[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 1 - Larger Array Fine Pitch Wafer Level Package Drop Test Reliability
Zhou, Tiao, Derk, Robert, Rahim, Kaysar, Fan, XuejunYear:
2009
Language:
english
DOI:
10.1115/InterPACK2009-89018
File:
PDF, 446 KB
english, 2009