Studies of two-dimensional h-BN and MoS2 for potential...

npj 2D Materials and Applications 2017 / 12 Vol. 1; Iss. 1

Studies of two-dimensional h-BN and MoS2 for potential diffusion barrier application in copper interconnect technology

Lo, Chun-Li, Catalano, Massimo, Smithe, Kirby K. H., Wang, Luhua, Zhang, Shengjiao, Pop, Eric, Kim, Moon J., Chen, Zhihong
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Volume:
1
Language:
english
Journal:
npj 2D Materials and Applications
DOI:
10.1038/s41699-017-0044-0
Date:
December, 2017
File:
PDF, 1.21 MB
english, 2017
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