Bonding technology based on solid porous Ag for large area...

Scripta Materialia 2018 / 03 Vol. 146

Bonding technology based on solid porous Ag for large area chips

Chen, Chuantong, Noh, Seungjun, Zhang, Hao, Choe, Chanyang, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki
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Volume:
146
Language:
english
Journal:
Scripta Materialia
DOI:
10.1016/j.scriptamat.2017.11.035
Date:
March, 2018
File:
PDF, 1.96 MB
english, 2018
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