Active Fluidic Cooling on Energy Constrained System-on-Chip...

IEEE Transactions on Components Packaging and Manufacturing Technology 2017 / 11 Vol. 7; Iss. 11

Active Fluidic Cooling on Energy Constrained System-on-Chip Systems

Yueh, Wen, Wan, Zhimin, Xiao, He, Yalamanchili, Sudhakar, Joshi, Yogendra, Mukhopadhyay, Saibal
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2746667
Date:
November, 2017
File:
PDF, 1.99 MB
english, 2017
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