A Modified Flip-Chip LED Packaging Design With Enhanced...

Journal of Electronic Packaging 2009 Vol. 131; Iss. 4

A Modified Flip-Chip LED Packaging Design With Enhanced Light Coupling Efficiency for Plastic Optical Fiber Networks

Wang, Chuen-Ching, Yang, Wen-Ran, Chen, Jin-Jia, Shi, Wei-Wen
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Volume:
131
Year:
2009
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4000207
File:
PDF, 1.52 MB
english, 2009
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