Analysis of Solderless Press-Fit Interconnections During the Assembly Process
Tohmyoh, Hironori, Yamanobe, Kiichiro, Saka, Masumi, Utsunomiya, Jiro, Nakamura, Takeshi, Nakano, YoshikatsuVolume:
130
Year:
2008
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2957330
File:
PDF, 443 KB
english, 2008