Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning
Wang, Chenxi, Xu, Jikai, Zeng, Xiaorun, Tian, Yanhong, Wang, Chunqing, Suga, TadatomoVolume:
57
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.57.02BD02
Date:
February, 2018
File:
PDF, 1.14 MB
english, 2018