The role of contact angle in the thermal conductivity of microencapsulated phase change material suspensions
Qiu, Zhongzhu, Le, Ping, Li, Peng, Qin, Chengfang, Jiang, Weiting, Zheng, Puyan, Zhang, Tao, Li, ChunyingVolume:
9
Language:
english
Journal:
Advances in Mechanical Engineering
DOI:
10.1177/1687814017728228
Date:
September, 2017
File:
PDF, 634 KB
english, 2017