Special issue on Design, Test, Integration and Packaging of...

Microsystem Technologies 2017 / 9 Vol. 23; Iss. 9

Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP 2015), held in Montpellier, France, April 27–30, 2015

Nouet, Pascal, Michel, Bernd
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Volume:
23
Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-017-3509-3
Date:
September, 2017
File:
PDF, 307 KB
english, 2017
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