Novel high temperature polymeric encapsulation material for...

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Materials & Design 2017 / 12

Novel high temperature polymeric encapsulation material for extreme environment electronics packaging

Phua, Eric Jian Rong, Liu, Ming, Cho, Bokun, Liu, Qing, Amini, Shahrouz, Hu, Xiao, Gan, Chee Lip
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Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2017.12.029
Date:
December, 2017
File:
PDF, 1.58 MB
english, 2017
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