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Additives-assisted electrodeposition of fine spherical copper powder from sulfuric acid solution
Lou, Wenbo, Cai, Weiquan, Li, Ping, Su, Junling, Zheng, Shili, Zhang, Yi, Jin, WeiLanguage:
english
Journal:
Powder Technology
DOI:
10.1016/j.powtec.2017.12.060
Date:
December, 2017
File:
PDF, 1.54 MB
english, 2017