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Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC–Cu Solder Joints During Different Types of Thermomechanical Excursion
Kanjilal, Anwesha, Kumar, PraveenVolume:
47
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-017-5786-0
Date:
January, 2018
File:
PDF, 2.39 MB
english, 2018