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Kinetics of Isothermal Reactive Diffusion Between Solid Cu and Liquid Sn
O, M., Suzuki, T., Kajihara, M.Volume:
47
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-017-5788-y
Date:
January, 2018
File:
PDF, 725 KB
english, 2018