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Microdiamond/PLA composites with enhanced thermal conductivity through improving filler/matrix interface compatibility
Su, Shiuan-Haur, Huang, Yajie, Qu, Shilian, Liu, Wei, Liu, Rongxuan, Li, LiangliangVolume:
81
Language:
english
Journal:
Diamond and Related Materials
DOI:
10.1016/j.diamond.2017.12.011
Date:
January, 2018
File:
PDF, 19.08 MB
english, 2018