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Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation
Li, Ganglong, Wu, Houya, Luo, Honglong, Chen, Zhuo, Tay, Andrew A. O., Zhu, WenhuiVolume:
7
Language:
english
Journal:
AIP Advances
DOI:
10.1063/1.4997677
Date:
September, 2017
File:
PDF, 17.22 MB
english, 2017