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Microstructure and reliability of Mo nanoparticle reinforced Sn–58Bi-based lead-free solder joints
Yang, Li, Zhu, Lu, Zhang, Yaocheng, Liu, Po, Zhang, Ning, Zhou, Shiyuan, Jiang, LichengLanguage:
english
Journal:
Materials Science and Technology
DOI:
10.1080/02670836.2017.1415791
Date:
December, 2017
File:
PDF, 7.03 MB
english, 2017