Coupled Temperature Displacement Model to Predict Residual Stresses in Milling Process
Pramod, Monangi, Reddy, Narahari Varun, Talluru, Viswajit, Reddy, Yarkareddy Gopi, Marimuthu, Prakash KVolume:
225
Language:
english
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/225/1/012026
Date:
August, 2017
File:
PDF, 1.37 MB
english, 2017