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Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications
Lau, John H., Lee, S. W. Ricky, Pan, Stephen H., Chang, ChrisVolume:
124
Year:
2002
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1462626
File:
PDF, 919 KB
english, 2002