Fabrication of package embedded spiral inductors with two...

Microelectronic Engineering 2018 / 04 Vol. 189

Fabrication of package embedded spiral inductors with two magnetic layers for flexible SIP point of load converters in Internet of Everything devices

Bellaredj, Mohamed L.F., Pardue, Colin A., Kohl, Paul, Swaminathan, Madhavan
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Volume:
189
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2017.12.012
Date:
April, 2018
File:
PDF, 3.32 MB
english, 2018
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