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Microvia Filling with Copper Electroplated with Quaternary Ammonium-Based Leveler: The Evaluation of Convection-Dependent Adsorption Behavior of the Leveler
Lee, Myung Hyun, Lee, Yoonjae, Oh, Jung Hwan, Kim, Young Gyu, Cho, Sung Ki, Kim, Jae JeongVolume:
164
Year:
2017
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.0121802jes
File:
PDF, 723 KB
english, 2017