Effect of solder bump shapes on underfill flow in flip-chip...

Microelectronics Reliability 2018 / 02 Vol. 81

Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches

Ng, Fei Chong, Abas, Aizat, Abdullah, M.Z.
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Volume:
81
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.12.025
Date:
February, 2018
File:
PDF, 5.67 MB
english, 2018
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